Availability:
734
pieces
| Products Specifications | |
|---|---|
| Speed | 500MHz, 1.2GHz |
| Width | 23mm |
| Length | 23mm |
| Series | Zynq® UltraScale+™ MPSoC EG |
| HTS Code | 8542.31.00.01 |
| RAM Size | 1.8MB |
| Packaging | Tray |
| Technology | CMOS |
| Part Status | Active |
| Peripherals | DMA, WDT |
| RoHS Status | ROHS3 Compliant |
| Architecture | MPU, FPGA |
| Connectivity | CANbus, I2C, SPI, UART/USART, USB |
| JESD-30 Code | S-PBGA-B784 |
| Number of I/O | 128 |
| Surface Mount | YES |
| Terminal Form | BALL |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Package / Case | 784-BFBGA, FCBGA |
| Supply Voltage | 0.85V |
| Terminal Pitch | 0.8mm |
| Factory Lead Time | 11 Weeks |
| Terminal Position | BOTTOM |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Height Seated (Max) | 3.32mm |
| Operating Temperature | -40°C~125°C TJ |
| Number of Terminations | 784 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
