| Speed | 667MHz |
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| Series | Zynq®-7000 |
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| HTS Code | 8542.39.00.01 |
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| RAM Size | 256KB |
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| Packaging | Tray |
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| Technology | CMOS |
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| Part Status | Active |
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| Peripherals | DMA |
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| RAM (words) | 256000 |
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| RoHS Status | Non-RoHS Compliant |
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| Architecture | MCU, FPGA |
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| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
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| JESD-30 Code | S-PBGA-B676 |
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| Boundary Scan | YES |
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| Number of I/O | 4 |
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| Surface Mount | YES |
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| Terminal Form | BALL |
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| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
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| Package / Case | 676-BBGA, FCBGA |
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| Clock Frequency | 667MHz |
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| Bus Compatibility | CAN, ETHERNET, I2C, PCI, SPI, UART, USB |
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| Factory Lead Time | 11 Weeks |
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| Terminal Position | BOTTOM |
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| Additional Feature | GPIO WITH FOUR 32-BIT BANKS |
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| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
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| Operating Temperature | -40°C~100°C TJ |
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| Number of Terminations | 676 |
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| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
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