
Availability:
1006
pieces
Products Specifications | |
---|---|
Length | 27mm |
Series | Zynq®-7000 |
HTS Code | 8542.39.00.01 |
RAM Size | 256KB |
ECCN Code | 3A991.D |
Frequency | 667MHz |
Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Packaging | Tray |
Pin Count | 676 |
Published | 2009 |
Technology | CMOS |
Part Status | Active |
Pbfree Code | yes |
Peripherals | DMA |
RAM (words) | 256000 |
RoHS Status | ROHS3 Compliant |
Speed Grade | -1 |
Subcategory | Other uPs/uCs/Peripheral ICs |
UV Erasable | N |
Architecture | MCU, FPGA |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Boundary Scan | YES |
JESD-609 Code | e1 |
Number of I/O | 130 |
Surface Mount | YES |
Terminal Form | BALL |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Data Bus Width | 32b |
Number of Pins | 676 |
Package / Case | 676-BBGA, FCBGA |
Power Supplies | 11.8V |
Supply Voltage | 1V |
Terminal Pitch | 1mm |
Contact Plating | Copper, Silver, Tin |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Base Part Number | XC7Z030 |
Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
Core Architecture | ARM |
Factory Lead Time | 10 Weeks |
Terminal Position | BOTTOM |
Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
Height Seated (Max) | 3.24mm |
Radiation Hardening | No |
Operating Temperature | -40°C~100°C TJ |
Number of Terminations | 676 |
Operating Supply Voltage | 1V |
Supply Voltage-Max (Vsup) | 1.05V |
Peak Reflow Temperature (Cel) | 245 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |