Availability:
269
pieces
| Products Specifications | |
|---|---|
| Width | 31mm |
| Length | 31mm |
| Series | Zynq®-7000 |
| HTS Code | 8542.39.00.01 |
| RAM Size | 256KB |
| ECCN Code | 3A991.D |
| Frequency | 667MHz |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Packaging | Tube |
| Published | 2010 |
| Technology | CMOS |
| Part Status | Active |
| Peripherals | DMA |
| RAM (words) | 256000 |
| RoHS Status | ROHS3 Compliant |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| JESD-30 Code | S-PBGA-B900 |
| Boundary Scan | YES |
| JESD-609 Code | e1 |
| Number of I/O | 212 |
| Surface Mount | YES |
| Terminal Form | BALL |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case | 900-BBGA, FCBGA |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Base Part Number | XC7Z100 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Core Architecture | ARM |
| Factory Lead Time | 10 Weeks |
| Terminal Position | BOTTOM |
| Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells |
| Height Seated (Max) | 3.35mm |
| Radiation Hardening | No |
| Operating Temperature | -40°C~100°C TJ |
| Number of Terminations | 900 |
| Supply Voltage-Max (Vsup) | 1.05V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Peak Reflow Temperature (Cel) | 245 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
