Availability:
254
pieces
| Products Specifications | |
|---|---|
| Speed | 533MHz, 1.3GHz |
| Series | Zynq® UltraScale+™ MPSoC CG |
| HTS Code | 8542.31.00.01 |
| RAM Size | 256KB |
| Packaging | Bulk |
| Published | 2016 |
| Technology | CMOS |
| Part Status | Active |
| Peripherals | DMA, WDT |
| RoHS Status | ROHS3 Compliant |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| JESD-30 Code | R-PBGA-B1156 |
| Number of I/O | 328 |
| Surface Mount | YES |
| Terminal Form | BALL |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Package / Case | 1156-BBGA, FCBGA |
| Supply Voltage | 0.85V |
| Factory Lead Time | 11 Weeks |
| Terminal Position | BOTTOM |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| Operating Temperature | -40°C~100°C TJ |
| Supply Voltage-Max (Vsup) | 0.876V |
| Supply Voltage-Min (Vsup) | 0.825V |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
